EP3C55F484I8N vs EP3C120F484I7N Vergleich
Detaillierter Direktvergleich von EP3C55F484I8N von Intel und EP3C120F484I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F484I8N | EP3C120F484I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $61,50 | $84,70 |
| Series | Cyclone III | — |
| Logic Elements (LE) | 55,856 | — |
| Logic Array Blocks (LAB) | 3,491 | — |
| Embedded Memory Bits | 2,396,160 bits (approximately 234 Kbytes) | 3,981,312 (approx. 4 Mbits) |
| Embedded Multipliers (18x18) | 312 | 288 |
| PLLs | 4 | — |
| User I/O Pins | 327 | — |
| I/O Banks | 8 | — |
| Core Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) | 1.15 V to 1.25 V |
| Auxiliary Voltage (VCCAUX) | 2.5 V nominal | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V per bank | — |
| Gehäuse | 484-ball FBGA (FineLine BGA), 23 mm x 23 mm | 484-FBGA (FBGA-484) 23 x 23 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Betriebs-Sperrschichttemperatur | -40 C to +100 C (industrial, suffix I8) | — |
| Speed Grade | 8 (slowest Cyclone III timing bin) | 7 (commercial/industrial) |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | Compliant (lead-free) |
| Lead-Free | Yes | — |
| MSL-Level | 3 | — |
| Family | — | Cyclone III |
| Device Type | — | FPGA |
| Logic Elements | — | 119,088 |
| Logic Array Blocks (LABs) | — | 7,443 |
| Embedded Memory (M9K blocks) | — | 432 |
| Maximum User I/O Pins | — | 283 |
| I/O Bank Count | — | 8 |
| Internal Operating Frequency (max) | — | 472 MHz |
| Betriebstemperatur | — | -40 °C to +100 °C (industrial, -I7N) |
| Halogenfrei | — | Compliant |