EP3C55F780C6 vs EP3C55F780C6N Vergleich
Detaillierter Direktvergleich von EP3C55F780C6 von Intel und EP3C55F780C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C6 | EP3C55F780C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $209,22 | $52,10 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 | — |
| Number of Block RAM (M9K) | 260 | — |
| 18x18 Hardware Multipliers | 156 | — |
| User I/Os | 377 | — |
| Gehäuse | 780-ball FBGA | 780-ball FBGA (F780) |
| Speed Grade | -6 (C6) | C6 |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Process Technology | 65 nm low power | 65 nm low-power CMOS |
| Configuration Methods | JTAG, AS, AP, PS | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Family | — | Cyclone III FPGA |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory (bits) | — | 2,396,160 |
| Embedded Memory (Kb) | — | 2,340 Kb |
| Embedded 18x18 Multipliers | — | 312 |
| Maximum User I/O | — | 377 |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Package Code | — | BGA, 780 balls |
| Voltage - Supply (Core) | — | 1.2 V (typical) |
| Voltage - I/O | — | Multi-standard (LVTTL/LVCMOS/LVDS/SSTL/PCI) |