Intel

EP3C55F780C6 - Cyclone III FPGA, 55K LEs, 780-BGA | Intel (Altera)

Teilenummer: EP3C55F780C6 ✓ Aktiv

Auf Lager Versand in 1–3 Werktagen

LVDS, LVTTL, LVCMOS, SSTL, HSTL Vdss 780-ball FBGA Package -6 (C6) Speed 2,396,160 Memory

Ab $209.22 USD / Stück

MOQ: 1 |

Preis aktualisiert: 2026-09-09

Mengenpreise

Menge	Stückpreis	Gesamt
1	$321.88	$321,88
10	$289.69	$2.896,90
100	$257.5	$25.750,00
250	$231.75	$57.937,50
500	$209.22	$104.610,00

ℹ️ Alle Preise sind in USD

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EP3C55F780C6 Übersicht

The Intel (formerly Altera) EP3C55F780C6 is a Cyclone III field-programmable gate array (FPGA) with 55,856 logic elements, 2,396,160 bits of embedded memory, and 156 18x18 hardware multipliers, housed in a 780-ball fine-pitch BGA package with 377 user I/Os. Built on a low-power 65nm process, the Cyclone III family delivers a balance of logic density, memory, and DSP capability at a fraction of the static power of competing 90nm FPGAs.

A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as block RAM and DSP slices. FPGAs sit in the programmable-logic tier of the digital semiconductor hierarchy: ASIC < structured ASIC < FPGA < CPLD < microcontroller. Designers use HDL (Verilog or VHDL) to describe the desired digital function, then synthesize, place, and route the design with vendor tools (Quartus II for the Cyclone III family). Unlike fixed-function ASICs, FPGAs allow in-system reconfiguration, making them ideal for prototyping, low-volume production, and designs that must evolve in the field.

Key features of the EP3C55F780C6 include a 4-Mbit embedded memory subsystem, four general-purpose PLLs for clock synthesis, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL on user I/Os. The 'C6' speed grade offers a -6 speed rating for internal logic, and the 'C' prefix denotes the commercial temperature grade of 0C to +85C. Static power consumption is significantly reduced compared to Cyclone II, enabling fan-less operation in cost-sensitive applications.

From an architectural perspective, the Cyclone III device family uses 4-input look-up tables (LUTs) per logic element, M9K block RAM tiles, and 18x18 multiplier blocks optimized for DSP. The 780-FBGA package provides high I/O density suitable for memory-bus bridging, video processing pipelines, and parallel sensor aggregation. Configuration is supported through JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes via the dedicated configuration pins.

Typical applications include industrial motor control, video surveillance and image processing, telecom line cards, low-cost ASIC prototyping, and embedded vision systems. The combination of DSP blocks and on-chip memory is particularly suited to digital filtering, FFT computation, and image pre-processing. Designers transitioning from older Cyclone II designs will find pin-compatible migration options within the family.

When designing with this device, ensure the PCB BGA layout meets the 1.0mm ball pitch clearance rules of the 780-FBGA package and that the Quartus II power-play analysis is run early in the design cycle. Decoupling must follow the reference design guidance in the Cyclone III Device Handbook.

This page synthesizes distributor pricing, drop-in Cyclone III alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers select the right Cyclone III variant for their application.

Drop-in-Alternativen für EP3C55F780C6 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.

Varianten dieser Serie

Modelle derselben Serie, die drop-in-kompatibel sind mit EP3C55F780C6 (gleiche Bauform und Footprint) – abweichend in Package, Process Technology, Speed Grade, Embedded 18x18 Multipliers, RoHS Status.

EP3C40F780C6

Altera

Package: 780-BGA (FineLine)

Process Technology: 60 nm low-power

Speed Grade: C6