EP3C55F780C6 vs EP3C55F780C7 Vergleich
Detaillierter Direktvergleich von EP3C55F780C6 von Intel und EP3C55F780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C6 | EP3C55F780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $209,22 | $76,75 |
| Series | Cyclone III | — |
| Logic Elements | 55,856 | — |
| Embedded Memory Bits | 2,396,160 | 2,396,160 bits (~234 Kbyte M9K) |
| Number of Block RAM (M9K) | 260 | — |
| 18x18 Hardware Multipliers | 156 | — |
| User I/Os | 377 | — |
| Gehäuse | 780-ball FBGA | 780-ball FBGA (F780) |
| Speed Grade | -6 (C6) | 7 |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| Process Technology | 65 nm low power | 65 nm TSMC low-power CMOS |
| Configuration Methods | JTAG, AS, AP, PS | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 55,856 |
| Embedded 18x18 Multipliers | — | 234 |
| PLLs | — | 4 |
| Maximum User I/O Pins | — | 377 |
| Core Voltage (VCCINT) | — | 1.2 V |
| Maximum Internal Clock Frequency | — | 437.5 MHz |
| Operating Temperature Grade | — | Commercial (C) |
| Configuration Modes | — | AS, PS, JTAG, FPP |