EP3C55F780C6 vs EP3C55F780C7N Vergleich
Detaillierter Direktvergleich von EP3C55F780C6 von Intel und EP3C55F780C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C6 | EP3C55F780C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $209,22 | $138,31 |
| Series | Cyclone III | — |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 | — |
| Number of Block RAM (M9K) | 260 | — |
| 18x18 Hardware Multipliers | 156 | — |
| User I/Os | 377 | — |
| Gehäuse | 780-ball FBGA | 780-ball FineLine BGA |
| Speed Grade | -6 (C6) | 7 |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C (commercial, C7 speed grade) |
| Process Technology | 65 nm low power | 65 nm low-power CMOS |
| Configuration Methods | JTAG, AS, AP, PS | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | — |
| Family | — | Cyclone III |
| Embedded Memory | — | 2,396,160 bits (approximately 2.4 Mbit) |
| Embedded Memory Blocks | — | 312 M9K blocks |
| Embedded Multipliers | — | 156 (18 x 18) |
| User I/O Count | — | 377 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Configuration Memory | — | 8 Kbits (supports PS, FPP, JTAG) |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Bank Voltage (VCCIO) | — | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |