EP3C55F780C6 vs EP3C55F780I7N Vergleich
Detaillierter Direktvergleich von EP3C55F780C6 von Intel und EP3C55F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C6 | EP3C55F780I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $209,22 | $195,00 |
| Series | Cyclone III | — |
| Logic Elements | 55,856 | 55,856 |
| Embedded Memory Bits | 2,396,160 | — |
| Number of Block RAM (M9K) | 260 | — |
| 18x18 Hardware Multipliers | 156 | — |
| User I/Os | 377 | — |
| Gehäuse | 780-ball FBGA | 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height) |
| Speed Grade | -6 (C6) | -7 (fastest) |
| Betriebstemperatur | 0C to +85C (Commercial) | — |
| Process Technology | 65 nm low power | 65 nm |
| Configuration Methods | JTAG, AS, AP, PS | — |
| Number of PLLs | 4 | — |
| Maximum User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS-Status | Compliant | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Family | — | Cyclone III |
| Total RAM Bits | — | 2,396,160 |
| Number of Logic Array Blocks (LABs) | — | 2,426 |
| Embedded 18x18 Multipliers | — | 56 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum User I/O Count | — | 377 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Maximum Internal Frequency | — | 472 MHz |
| Lead-Free / RoHS | — | Lead free, RoHS compliant |
| Configuration Scheme | — | Passive Serial / JTAG / Active Serial |