EP3C55F780C7 vs EP3C55F780I7N Vergleich
Detaillierter Direktvergleich von EP3C55F780C7 von Intel und EP3C55F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C7 | EP3C55F780I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $76,75 | $195,00 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 56 |
| PLLs | 4 | — |
| Maximum User I/O Pins | 377 | — |
| Gehäuse | 780-ball FBGA (F780) | 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | -7 (fastest) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | — |
| Logic Elements | — | 55,856 |
| Total RAM Bits | — | 2,396,160 |
| Number of Logic Array Blocks (LABs) | — | 2,426 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum User I/O Count | — | 377 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Maximum Internal Frequency | — | 472 MHz |
| Lead-Free / RoHS | — | Lead free, RoHS compliant |
| Configuration Scheme | — | Passive Serial / JTAG / Active Serial |