EP3C55F780C7 vs EP3C55F780I7N Comparación
Comparación detallada lado a lado de EP3C55F780C7 por Intel y EP3C55F780I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55F780C7 | EP3C55F780I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $76,75 | $195,00 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 56 |
| PLLs | 4 | — |
| Maximum User I/O Pins | 377 | — |
| Encapsulado | 780-ball FBGA (F780) | 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 65 nm |
| Operating Temperature Grade | Commercial (C) | — |
| Speed Grade | 7 | -7 (fastest) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | Compliant | — |
| Logic Elements | — | 55,856 |
| Total RAM Bits | — | 2,396,160 |
| Number of Logic Array Blocks (LABs) | — | 2,426 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Maximum User I/O Count | — | 377 |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Industrial) | — | -40 °C to +100 °C |
| Maximum Internal Frequency | — | 472 MHz |
| Lead-Free / RoHS | — | Lead free, RoHS compliant |
| Configuration Scheme | — | Passive Serial / JTAG / Active Serial |