EP3C55F780C7 vs EP3CLS100F780C8 Vergleich
Detaillierter Direktvergleich von EP3C55F780C7 von Intel und EP3CLS100F780C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55F780C7 | EP3CLS100F780C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $76,75 | $65,00 |
| Family | Cyclone III | Cyclone III LS |
| Logic Elements (LE) | 55,856 | 100,448 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 483 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | — |
| Gehäuse | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 60 nm low-power TSMC |
| Operating Temperature Grade | Commercial (C) | Commercial (C8 speed grade) |
| Speed Grade | 7 | 8 (slowest commercial) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| Total Embedded Memory | — | 4,451,328 bits |
| Embedded Memory Blocks (M9K) | — | 483 |
| Maximum User I/O | — | 413 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Bitstream Encryption | — | AES-256 (Cyclone III LS feature) |
| Configuration Controller | — | Cyclone III LS (AES-enabled) |