EP3C55F780C7 vs EP3CLS100F780C8 Comparación
Comparación detallada lado a lado de EP3C55F780C7 por Intel y EP3CLS100F780C8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55F780C7 | EP3CLS100F780C8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $76,75 | $65,00 |
| Family | Cyclone III | Cyclone III LS |
| Logic Elements (LE) | 55,856 | 100,448 |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbyte M9K) | — |
| Embedded 18x18 Multipliers | 234 | 483 |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 377 | — |
| Encapsulado | 780-ball FBGA (F780) | 780-ball FBGA (F780) |
| Core Voltage (VCCINT) | 1.2 V | — |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Process Technology | 65 nm TSMC low-power CMOS | 60 nm low-power TSMC |
| Operating Temperature Grade | Commercial (C) | Commercial (C8 speed grade) |
| Speed Grade | 7 | 8 (slowest commercial) |
| Configuration Modes | AS, PS, JTAG, FPP | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count] |
| Total Embedded Memory | — | 4,451,328 bits |
| Embedded Memory Blocks (M9K) | — | 483 |
| Maximum User I/O | — | 413 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Bitstream Encryption | — | AES-256 (Cyclone III LS feature) |
| Configuration Controller | — | Cyclone III LS (AES-enabled) |