EP3C55F780C8N vs EP3C55F780I7N Vergleich

Detaillierter Direktvergleich von EP3C55F780C8N von Intel und EP3C55F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C55F780C8N EP3C55F780I7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $58,20 $195,00
Series Cyclone III —
Family Cyclone III (low-cost FPGA) Cyclone III
Logic Elements (LE) 55,856 —
Logic Array Blocks (LAB) 3,491 —
Total RAM Bits 2,396,160 bits (2396 Kbit) 2,396,160
Embedded Memory Blocks (M9K) 260 —
Embedded 18x18 Multipliers 156 56
PLLs 4 —
Maximum User I/O 377 —
User I/O Banks 4 —
Process Technology 65 nm TSMC low-power 65 nm
Core Supply Voltage 1.15 V to 1.25 V —
Gehäuse 780-pin FBGA (29x29 mm, 1.0 mm pitch) 780-FBGA (29 x 29 mm, 1 mm pitch, 2.60 mm height)
Speed Grade 8 (commercial, slowest) -7 (fastest)
Betriebstemperatur 0C to +85C (commercial, 'C' suffix) —
Configuration Modes Active Serial, Passive Serial, Fast Passive Parallel, JTAG —
Internal Frequency (typ.) 402 MHz —
RoHS-Status Compliant (lead-free FBGA) —
Logic Elements — 55,856
Number of Logic Array Blocks (LABs) — 2,426
Phase-Locked Loops (PLLs) — 4
Maximum User I/O Count — 377
Core Voltage — 1.2 V
Operating Temperature (Industrial) — -40 °C to +100 °C
Maximum Internal Frequency — 472 MHz
Montageart — Surface Mount
Lead-Free / RoHS — Lead free, RoHS compliant
Configuration Scheme — Passive Serial / JTAG / Active Serial

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