EP3C55U484C7N vs EP3C55U484C6N Vergleich
Detaillierter Direktvergleich von EP3C55U484C7N von Intel und EP3C55U484C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55U484C7N | EP3C55U484C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $140,25 | $274,06 |
| Series | Cyclone III | — |
| Logic Elements | 55,856 | 55856 LE |
| Embedded Memory Bits | 2,396,160 (2.4 Mbit) | — |
| Maximum User I/Os | 327 | — |
| I/O Banks | 8 | — |
| DSP Blocks (18 x 18 Multipliers) | 156 (260 multipliers reported by some sources - [DATA_NEEDED: confirm multiplier count from device handbook]) | — |
| PLLs | 4 | — |
| M9K Memory Blocks | 260 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | [DATA_NEEDED: operating temperature range] |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Gehäuse | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm | 484-FBGA |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Family | — | Cyclone III |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Wärmewiderstand | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |