EP3C55U484C7N vs EP3C55U484C6N Сравнение
Подробное сравнение бок о бок EP3C55U484C7N от Intel и EP3C55U484C6N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EP3C55U484C7N | EP3C55U484C6N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | NRND | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $140,25 | $274,06 |
| Series | Cyclone III | — |
| Logic Elements | 55,856 | 55856 LE |
| Embedded Memory Bits | 2,396,160 (2.4 Mbit) | — |
| Maximum User I/Os | 327 | — |
| I/O Banks | 8 | — |
| DSP Blocks (18 x 18 Multipliers) | 156 (260 multipliers reported by some sources - [DATA_NEEDED: confirm multiplier count from device handbook]) | — |
| PLLs | 4 | — |
| M9K Memory Blocks | 260 | — |
| Process Technology | 65 nm low-power CMOS | 65 nm |
| Core Voltage (VCCINT) | 1.2 V | — |
| Рабочая температура | 0 °C to +85 °C (commercial) | [DATA_NEEDED: operating temperature range] |
| Maximum Internal Clock Frequency | 437.5 MHz | — |
| Корпус | 484-pin UBGA (Ultra FineLine BGA), 19 mm × 19 mm | 484-FBGA |
| Тип монтажа | Surface Mount (BGA) | Surface Mount |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Статус RoHS | Compliant | Compliant |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Family | — | Cyclone III |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Тепловое сопротивление | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |