EP3C55U484C8N vs EP3C55U484C6N Vergleich
Detaillierter Direktvergleich von EP3C55U484C8N von Intel und EP3C55U484C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C55U484C8N | EP3C55U484C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $119,85 | $274,06 |
| Series | Cyclone III | — |
| Family | EP3C55 | Cyclone III |
| Logic Elements | 55,856 | 55856 LE |
| Embedded Memory (bits) | 2,396,160 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of M9K Memory Blocks | 250 | — |
| Embedded 18x18 Multipliers | 156 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/Os | 327 | — |
| Number of I/O Banks | 8 | — |
| Gehäuse | 484-UBGA (Ultra FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 484-FBGA |
| Speed Grade | 8 (commercial, fastest) | — |
| Process Technology | 60 nm low-power CMOS | 65 nm |
| Betriebstemperatur | 0 C to +85 C (commercial) | [DATA_NEEDED: operating temperature range] |
| Montageart | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Compliant (per DigiKey listing) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| RoHS-Status | — | Compliant |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Wärmewiderstand | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |