EP3C55U484C8N vs EP3C55U484C6N Comparaison
Comparaison détaillée côte à côte de EP3C55U484C8N par Intel et EP3C55U484C6N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3C55U484C8N | EP3C55U484C6N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $119,85 | $274,06 |
| Series | Cyclone III | — |
| Family | EP3C55 | Cyclone III |
| Logic Elements | 55,856 | 55856 LE |
| Embedded Memory (bits) | 2,396,160 | — |
| Number of Logic Array Blocks (LABs) | 3,491 | — |
| Number of M9K Memory Blocks | 250 | — |
| Embedded 18x18 Multipliers | 156 | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Maximum User I/Os | 327 | — |
| Number of I/O Banks | 8 | — |
| Boîtier | 484-UBGA (Ultra FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 484-FBGA |
| Speed Grade | 8 (commercial, fastest) | — |
| Process Technology | 60 nm low-power CMOS | 65 nm |
| Température de fonctionnement | 0 C to +85 C (commercial) | [DATA_NEEDED: operating temperature range] |
| Type de montage | Surface Mount | Surface Mount |
| Lead-Free / RoHS | Compliant (per DigiKey listing) | — |
| Product Type | — | Field Programmable Gate Array (FPGA) |
| Number of Logic Cells | — | 55856 cells |
| Embedded Memory | — | 2396160 bit |
| I/O Count | — | 327 I/O |
| Core Technology Voltage | — | 1.2 V |
| JTAG LVTTL/LVCMOS Operation | — | 3.3 V, 3.0 V, 2.5 V |
| Package Code | — | FBGA |
| Terminal Count | — | 484 |
| Terminal Form | — | Ball |
| Clock Rate | — | 437.5 MHz |
| Statut RoHS | — | Compliant |
| REACH Status | — | unknown |
| Automotive Qualification | — | unknown |
| Lead-Free Status | — | unknown |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum I/O Voltage | — | [DATA_NEEDED: maximum I/O voltage] |
| Résistance thermique | — | [DATA_NEEDED: junction-to-ambient thermal resistance] |