EP3C5F256C6 vs EP3C5F256C6N Vergleich
Detaillierter Direktvergleich von EP3C5F256C6 von Intel und EP3C5F256C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256C6 | EP3C5F256C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $21,40 | $18,85 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | 182 (per DigiKey listing) |
| Total Memory Bits | 423,936 bits | 423936 |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| User I/Os | 182 | — |
| PLLs | 4 | 2 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | 1.2 V |
| Process Technology | 65 nm CMOS, low-k | — |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Gehäuse | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Montageart | Surface Mount | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | Serial, Parallel, JTAG, AS, PS |
| RoHS-Status | Compliant (lead-free per FBGA package) | — |
| Series | — | EP3C5 |
| Logic Elements (LEs) | — | 5136 |
| Maximum User I/Os | — | 182 |
| Core Process Technology | — | 65 nm CMOS |
| Betriebstemperatur | — | 0 C to +85 C (commercial "C6" speed grade) |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |