EP3C5F256C6 vs EP3C5F256C6N Comparación
Comparación detallada lado a lado de EP3C5F256C6 por Intel y EP3C5F256C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5F256C6 | EP3C5F256C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $21,40 | $18,85 |
| Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 5,136 | — |
| Logic Array Blocks (LABs) | 5136 / 342 (per ADatasheet summary) | 182 (per DigiKey listing) |
| Total Memory Bits | 423,936 bits | 423936 |
| Embedded Memory | M9K blocks (per Cyclone III family) | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| User I/Os | 182 | — |
| PLLs | 4 | 2 |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.15 V to 1.25 V (typical 1.2 V) | 1.2 V |
| Process Technology | 65 nm CMOS, low-k | — |
| Maximum Operating Frequency | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] | — |
| Encapsulado | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA), 17 x 17 mm, 1 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount |
| Operating Temperature (Commercial) | 0C to +85C (per device suffix C6) | — |
| Configuration Modes | AS, PS, JTAG | Serial, Parallel, JTAG, AS, PS |
| Estado RoHS | Compliant (lead-free per FBGA package) | — |
| Series | — | EP3C5 |
| Logic Elements (LEs) | — | 5136 |
| Maximum User I/Os | — | 182 |
| Core Process Technology | — | 65 nm CMOS |
| Temperatura de funcionamiento | — | 0 C to +85 C (commercial "C6" speed grade) |
| RoHS / Lead-Free | — | Lead-free (per distributor listings) |