EP3C5F256C8 vs EP3C5F256C6 Vergleich
Detaillierter Direktvergleich von EP3C5F256C8 von Intel und EP3C5F256C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256C8 | EP3C5F256C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,30 | $21,40 |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Series | Cyclone III | — |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 | 423,936 bits |
| Number of LABs/CLBs | 321 | — |
| Number of Logic Elements/Cells | 5,136 | — |
| Maximum User I/O | 182 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Betriebstemperatur | -40°C to +125°C | — |
| Package Type | 256-LBGA (FineLine BGA) | — |
| Package Code | FBGA-256 | — |
| Montageart | Surface Mount | Surface Mount |
| Versorgungsspannung | [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] | — |
| Configuration Memory | External flash via AS/PS/JTAG/FPP | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS, low-k |
| Embedded Multipliers | Yes (18x18 hard multipliers) | — |
| PLLs | Yes (general-purpose PLLs) | 4 |
| RoHS-Status | Lead Free, MS-034 | Compliant (lead-free per FBGA package) |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 5136 / 342 (per ADatasheet summary) |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | — | 23 |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Gehäuse | — | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Configuration Modes | — | AS, PS, JTAG |