EP3C5F256C8 vs EP3C5F256C6 Comparaison
Comparaison détaillée côte à côte de EP3C5F256C8 par Intel et EP3C5F256C6 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3C5F256C8 | EP3C5F256C6 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $12,30 | $21,40 |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Series | Cyclone III | — |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 | 423,936 bits |
| Number of LABs/CLBs | 321 | — |
| Number of Logic Elements/Cells | 5,136 | — |
| Maximum User I/O | 182 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Température de fonctionnement | -40°C to +125°C | — |
| Package Type | 256-LBGA (FineLine BGA) | — |
| Package Code | FBGA-256 | — |
| Type de montage | Surface Mount | Surface Mount |
| Tension d'alimentation | [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] | — |
| Configuration Memory | External flash via AS/PS/JTAG/FPP | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS, low-k |
| Embedded Multipliers | Yes (18x18 hard multipliers) | — |
| PLLs | Yes (general-purpose PLLs) | 4 |
| Statut RoHS | Lead Free, MS-034 | Compliant (lead-free per FBGA package) |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 5136 / 342 (per ADatasheet summary) |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | — | 23 |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Boîtier | — | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Configuration Modes | — | AS, PS, JTAG |