EP3C5F256C8 vs EP3C5F256C7N Vergleich

Detaillierter Direktvergleich von EP3C5F256C8 von Intel und EP3C5F256C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C5F256C8 EP3C5F256C7N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $12,30 $14,20
Device Type FPGA - Field Programmable Gate Array FPGA - Field Programmable Gate Array
Series Cyclone III —
Logic Elements 5,136 —
Total Memory Bits 423,936 —
Number of LABs/CLBs 321 —
Number of Logic Elements/Cells 5,136 —
Maximum User I/O 182 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Betriebstemperatur -40°C to +125°C 0C to +85C (commercial, per 'C' speed bin)
Package Type 256-LBGA (FineLine BGA) —
Package Code FBGA-256 —
Montageart Surface Mount —
Versorgungsspannung [DATA_NEEDED: VCCINT/VCCA/VCCIO supply voltage values] —
Configuration Memory External flash via AS/PS/JTAG/FPP —
Process Technology 65 nm low-power CMOS 65 nm low-power CMOS
Embedded Multipliers Yes (18x18 hard multipliers) —
PLLs Yes (general-purpose PLLs) 2
RoHS-Status Lead Free, MS-034 Compliant (lead-free FBGA)
MSL-Level [DATA_NEEDED: MSL rating] —
Family — Cyclone III
Logic Elements (LEs) — 5,136
Logic Array Blocks (LABs) — 182
Total Embedded Memory — 423,936 bits (414 Kbit)
Embedded Multipliers (18x18) — 23
M9K Memory Blocks — 46
User I/Os — 182
User I/O Banks — 8
Gehäuse — 256-LBGA (FineLine BGA, 17x17 mm)
Speed Grade — -7 (commercial, slowest C-tier)
Core Voltage — 1.2 V (nominal)
Lead-Free / Pb-Free — Yes (suffix 'N' denotes lead-free)
Configuration Modes — JTAG, AS, AP, PS

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern