EP3C5F256C8N vs EP3C5F256C6 Vergleich
Detaillierter Direktvergleich von EP3C5F256C8N von Intel und EP3C5F256C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256C8N | EP3C5F256C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $10,95 | $21,40 |
| Series | Cyclone III | — |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | — |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 4 |
| Maximum User I/Os | 182 | — |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V (typical 1.2 V) |
| Betriebstemperatur | 0C to 85C (Commercial) | — |
| Gehäuse | 256-ball FBGA (FineLine BGA) | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Process Technology | 65 nm | 65 nm CMOS, low-k |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| RoHS-Status | Lead Free (per Altera/Intel product page) | Compliant (lead-free per FBGA package) |
| Montageart | Surface Mount | Surface Mount |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 5136 / 342 (per ADatasheet summary) |
| Total Memory Bits | — | 423,936 bits |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Configuration Modes | — | AS, PS, JTAG |