EP3C5F256C8N vs EP3C5F256C6 Comparaison
Comparaison détaillée côte à côte de EP3C5F256C8N par Intel et EP3C5F256C6 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3C5F256C8N | EP3C5F256C6 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $10,95 | $21,40 |
| Series | Cyclone III | — |
| Device Family | Cyclone III (EP3C5) | — |
| Logic Elements (LEs) | 5,136 | — |
| Embedded Memory (bits) | 423,936 | — |
| Embedded Memory (Kbits) | 414 Kbits | — |
| Embedded 18x18 Multipliers | 23 | 23 |
| PLLs | 4 | 4 |
| Maximum User I/Os | 182 | — |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V (typical 1.2 V) |
| Température de fonctionnement | 0C to 85C (Commercial) | — |
| Boîtier | 256-ball FBGA (FineLine BGA) | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Process Technology | 65 nm | 65 nm CMOS, low-k |
| Configuration Memory | SRAM-based (in-system reprogrammable) | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL | — |
| Statut RoHS | Lead Free (per Altera/Intel product page) | Compliant (lead-free per FBGA package) |
| Type de montage | Surface Mount | Surface Mount |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 5136 / 342 (per ADatasheet summary) |
| Total Memory Bits | — | 423,936 bits |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |
| Configuration Modes | — | AS, PS, JTAG |