EP3C5F256I7N vs EP3C5F256C6 Vergleich
Detaillierter Direktvergleich von EP3C5F256I7N von Intel und EP3C5F256C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256I7N | EP3C5F256C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,00 | $21,40 |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | 423,936 bits |
| Embedded Multipliers (18x18) | 26 | — |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | — |
| Gehäuse | 256-FBGA (FineLine BGA) | 256-pin FBGA (FineLine BGA), 17 x 17 mm, 1.0 mm pitch |
| Betriebstemperatur | -40C to +125C (Industrial) | — |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | 65 nm CMOS, low-k |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | AS, PS, JTAG |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| RoHS-Status | Compliant | Compliant (lead-free per FBGA package) |
| MSL-Level | 3 (168 hours) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | 5,136 |
| Logic Array Blocks (LABs) | — | 5136 / 342 (per ADatasheet summary) |
| Embedded Memory | — | M9K blocks (per Cyclone III family) |
| Embedded 18x18 Multipliers | — | 23 |
| User I/Os | — | 182 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.15 V to 1.25 V (typical 1.2 V) |
| Maximum Operating Frequency | — | [DATA_NEEDED: per design tool fmax, ADatasheet snippet lists 472.5 MHz device top speed] |
| Operating Temperature (Commercial) | — | 0C to +85C (per device suffix C6) |