EP3C5F256I7N vs EP3C5F256C8N Vergleich
Detaillierter Direktvergleich von EP3C5F256I7N von Intel und EP3C5F256C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256I7N | EP3C5F256C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,00 | $10,95 |
| Family | Cyclone III | — |
| Logic Elements | 5,136 | — |
| Total Memory Bits | 423,936 bits | — |
| Embedded Multipliers (18x18) | 26 | — |
| PLLs | 2 | 4 |
| Maximum User I/Os | 182 | 182 |
| Gehäuse | 256-FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA) |
| Betriebstemperatur | -40C to +125C (Industrial) | 0C to 85C (Commercial) |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | 65 nm |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| RoHS-Status | Compliant | Lead Free (per Altera/Intel product page) |
| MSL-Level | 3 (168 hours) | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Series | — | Cyclone III |
| Device Family | — | Cyclone III (EP3C5) |
| Logic Elements (LEs) | — | 5,136 |
| Embedded Memory (bits) | — | 423,936 |
| Embedded Memory (Kbits) | — | 414 Kbits |
| Embedded 18x18 Multipliers | — | 23 |
| Core Voltage | — | 1.15 V to 1.25 V |
| Configuration Memory | — | SRAM-based (in-system reprogrammable) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |