EP3C5F256I7N vs EP3C5U256A7N Vergleich
Detaillierter Direktvergleich von EP3C5F256I7N von Intel und EP3C5U256A7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5F256I7N | EP3C5U256A7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,00 | $16,20 |
| Family | Cyclone III | — |
| Logic Elements | 5,136 | 5,136 LE |
| Total Memory Bits | 423,936 bits | — |
| Embedded Multipliers (18x18) | 26 | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | 2 | — |
| Maximum User I/Os | 182 | — |
| Gehäuse | 256-FBGA (FineLine BGA) | — |
| Betriebstemperatur | -40C to +125C (Industrial) | — |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | — |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 (168 hours) | — |
| Montageart | Surface Mount (BGA) | — |
| Series | — | Cyclone III |
| Embedded Memory | — | 414 kbit (423,936 bits) |
| Number of I/Os | — | 182 |
| Operating Supply Voltage (Core) | — | 1.15 V to 1.25 V |
| Montagestil | — | SMD/SMT |
| Gehäuse / Bauform | — | BGA-256 (U256 Ultra FineLine) |
| Packaging | — | Tray |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +125 C (Automotive grade) |
| Temperature Grade | — | Automotive |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Number of PLLs | — | 4 |
| Process Node | — | 60 nm low-power CMOS |
| Speed Grade | — | -7 |