EP3C5F256I7N vs EP3C5U256A7N Comparación
Comparación detallada lado a lado de EP3C5F256I7N por Intel y EP3C5U256A7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5F256I7N | EP3C5U256A7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,00 | $16,20 |
| Family | Cyclone III | — |
| Logic Elements | 5,136 | 5,136 LE |
| Total Memory Bits | 423,936 bits | — |
| Embedded Multipliers (18x18) | 26 | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | 2 | — |
| Maximum User I/Os | 182 | — |
| Encapsulado | 256-FBGA (FineLine BGA) | — |
| Temperatura de funcionamiento | -40C to +125C (Industrial) | — |
| Supply Voltage - Core | 1.15 V to 1.25 V (typical 1.2 V) | — |
| Process Technology | TSMC 65nm low-power | — |
| Configuration Modes | Active Serial, Passive Serial, JTAG, FPP | — |
| I/O Standards | LVTTL, LVCMOS, LVDS, SSTL, HSTL | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (168 hours) | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Series | — | Cyclone III |
| Embedded Memory | — | 414 kbit (423,936 bits) |
| Number of I/Os | — | 182 |
| Operating Supply Voltage (Core) | — | 1.15 V to 1.25 V |
| Estilo de montaje | — | SMD/SMT |
| Encapsulado / Carcasa | — | BGA-256 (U256 Ultra FineLine) |
| Packaging | — | Tray |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +125 C (Automotive grade) |
| Temperature Grade | — | Automotive |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Number of PLLs | — | 4 |
| Process Node | — | 60 nm low-power CMOS |
| Speed Grade | — | -7 |