EP3C5U256A7N vs EP3C5U256C6N Vergleich
Detaillierter Direktvergleich von EP3C5U256A7N von Intel und EP3C5U256C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C5U256A7N | EP3C5U256C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $16,20 | $25,40 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 5,136 LE | 5,136 |
| Embedded Memory | 414 kbit (423,936 bits) | 423,936 bits |
| Number of I/Os | 182 | — |
| Operating Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| Montagestil | SMD/SMT | — |
| Gehäuse / Bauform | BGA-256 (U256 Ultra FineLine) | — |
| Packaging | Tray | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +125 C (Automotive grade) | — |
| Temperature Grade | Automotive | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Number of PLLs | 4 | — |
| Process Node | 60 nm low-power CMOS | — |
| Speed Grade | -7 | C6 |
| RoHS-Status | Compliant | — |
| Device Family | — | Cyclone III FPGA |
| Logic Array Blocks (LABs) | — | 321 |
| Maximum User I/Os | — | 182 |
| Gehäuse | — | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Process Technology | — | 60 nm low-power CMOS |
| Montageart | — | Surface Mount (BGA) |
| Lead Free / RoHS | — | Yes / Compliant |
| Configuration Modes | — | AS, PS, JTAG, Fast Passive Parallel |