EP3C5U256A7N vs EP3C5U256C6N Comparación
Comparación detallada lado a lado de EP3C5U256A7N por Intel y EP3C5U256C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C5U256A7N | EP3C5U256C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $16,20 | $25,40 |
| Series | Cyclone III | Cyclone III |
| Logic Elements | 5,136 LE | 5,136 |
| Embedded Memory | 414 kbit (423,936 bits) | 423,936 bits |
| Number of I/Os | 182 | — |
| Operating Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| Estilo de montaje | SMD/SMT | — |
| Encapsulado / Carcasa | BGA-256 (U256 Ultra FineLine) | — |
| Packaging | Tray | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +125 C (Automotive grade) | — |
| Temperature Grade | Automotive | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Number of PLLs | 4 | — |
| Process Node | 60 nm low-power CMOS | — |
| Speed Grade | -7 | C6 |
| Estado RoHS | Compliant | — |
| Device Family | — | Cyclone III FPGA |
| Logic Array Blocks (LABs) | — | 321 |
| Maximum User I/Os | — | 182 |
| Encapsulado | — | 256-UBGA (Ultra FineLine BGA) |
| Package Body Size | — | 14 x 14 mm |
| Ball Pitch | — | 0.80 mm |
| Package Height | — | 2.20 mm |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Process Technology | — | 60 nm low-power CMOS |
| Tipo de montaje | — | Surface Mount (BGA) |
| Lead Free / RoHS | — | Yes / Compliant |
| Configuration Modes | — | AS, PS, JTAG, Fast Passive Parallel |