EP3C80F484I7N vs EP3C80F484I7 Vergleich
Detaillierter Direktvergleich von EP3C80F484I7N von Intel und EP3C80F484I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C80F484I7N | EP3C80F484I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $286,91 | $105,30 |
| Series | Cyclone III | Cyclone III |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Logic Elements | 81,264 | 81,264 |
| Embedded Memory (RAM bits) | 2,810,880 | — |
| User I/O Count | 295 | — |
| Number of Logic Blocks / CLBs | 81,264 | — |
| Core Supply Voltage VCCINT | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| I/O Supply Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Maximum Internal Clock Frequency | 472.5 MHz | — |
| Number of PLLs | 4 | — |
| Number of 18x18 Multipliers | 244 | — |
| Process Technology | 60 nm low-power CMOS, SRAM-based | 65 nm low-power CMOS |
| Operating Temperature (Junction) | -40C to +100C (industrial I7 grade) | — |
| Gehäuse | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| MSL-Level | 3 | 3 (per JEDEC J-STD-020) |
| Configuration Method | AS / PS / JTAG / FPP | — |
| Logic Array Blocks (LABs) | — | 5,079 |
| Total RAM Bits | — | 2,810,880 |
| M9K Memory Blocks | — | 244 |
| Embedded Multipliers (18x18) | — | 305 |
| Phase-Locked Loops (PLLs) | — | 4 |
| User I/Os | — | 295 |
| Core Voltage | — | 1.2 V |
| Internal Operating Frequency | — | Up to 472 MHz |
| Betriebstemperatur | — | -40C to +100C (Industrial grade, "I7" suffix) |