EP3C80F484I7N vs EP3C80F484I7 Comparación
Comparación detallada lado a lado de EP3C80F484I7N por Intel y EP3C80F484I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C80F484I7N | EP3C80F484I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $286,91 | $105,30 |
| Series | Cyclone III | Cyclone III |
| Device Type | FPGA - Field Programmable Gate Array | FPGA |
| Logic Elements | 81,264 | 81,264 |
| Embedded Memory (RAM bits) | 2,810,880 | — |
| User I/O Count | 295 | — |
| Number of Logic Blocks / CLBs | 81,264 | — |
| Core Supply Voltage VCCINT | 1.15 V to 1.25 V (nominal 1.2 V) | — |
| I/O Supply Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Maximum Internal Clock Frequency | 472.5 MHz | — |
| Number of PLLs | 4 | — |
| Number of 18x18 Multipliers | 244 | — |
| Process Technology | 60 nm low-power CMOS, SRAM-based | 65 nm low-power CMOS |
| Operating Temperature (Junction) | -40C to +100C (industrial I7 grade) | — |
| Encapsulado | 484-ball FBGA, 23 x 23 mm, 1.0 mm pitch | 484-FBGA (FineLine BGA), 23x23 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Nivel MSL | 3 | 3 (per JEDEC J-STD-020) |
| Configuration Method | AS / PS / JTAG / FPP | — |
| Logic Array Blocks (LABs) | — | 5,079 |
| Total RAM Bits | — | 2,810,880 |
| M9K Memory Blocks | — | 244 |
| Embedded Multipliers (18x18) | — | 305 |
| Phase-Locked Loops (PLLs) | — | 4 |
| User I/Os | — | 295 |
| Core Voltage | — | 1.2 V |
| Internal Operating Frequency | — | Up to 472 MHz |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial grade, "I7" suffix) |