EP3CLS100F780C7 vs EP3CLS100F780C8 Vergleich

Detaillierter Direktvergleich von EP3CLS100F780C7 von Intel und EP3CLS100F780C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS100F780C7 EP3CLS100F780C8
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $632,40 $65,00
Family Cyclone III LS Cyclone III LS
Logic Elements (LEs) 100,448 —
Total RAM Bits 4,451,328 —
Embedded Memory M9K blocks (488 total, 4,451,328 bits) —
Embedded 18x18 Multipliers 66 483
Maximum User I/O Pins 413 —
Logic Array Blocks (LABs) [DATA_NEEDED: exact LAB count for EP3CLS100] —
Gehäuse 780-ball FineLine BGA (FBGA-780) 780-ball FBGA (F780)
Package Dimensions 29 mm x 29 mm —
Ball Pitch 1.0 mm —
Core Supply Voltage (VCCINT) 1.2 V —
I/O Supply Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) —
Process Technology 60 nm low-power CMOS 60 nm low-power TSMC
Configuration Modes Active Serial (AS), Passive Serial (PS), JTAG —
Bitstream Encryption AES-128 (Cyclone III LS security feature) AES-256 (Cyclone III LS feature)
Betriebs-Sperrschichttemperatur 0C to +85C (commercial, 'C' grade) —
RoHS-Status Compliant (lead-free FBGA) Compliant
Speed Grade 7 (C7) 8 (slowest commercial)
Logic Elements (LE) — 100,448
Logic Array Blocks (LAB) — [DATA_NEEDED: LAB count]
Total Embedded Memory — 4,451,328 bits
Embedded Memory Blocks (M9K) — 483
Maximum User I/O — 413
PLLs — 4
Global Clock Networks — 20
Core Voltage — 1.2 V
Device Type — FPGA - Field Programmable Gate Array
Operating Temperature Grade — Commercial (C8 speed grade)
Montageart — Surface Mount (BGA)
Configuration Controller — Cyclone III LS (AES-enabled)

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