EP3CLS100F780C8N vs EP3C80F780C8N Vergleich
Detaillierter Direktvergleich von EP3CLS100F780C8N von Intel und EP3C80F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS100F780C8N | EP3C80F780C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $105,80 | $240,20 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | — |
| Total Memory Bits | 4,451,328 | — |
| Embedded Memory Blocks | M9K + M144K | — |
| Logic Array Blocks (LAB) | 6,278 | — |
| Number of PLLs | 4 | — |
| Maximum User I/O | 429 | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Analog Supply (VCCA) | 2.5 V | — |
| Process Technology | 65 nm low-power CMOS | — |
| Maximum Embedded Multipliers (18x18) | 244 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm ball pitch | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Configuration Schemes | AS, PS, PP, JTAG | — |
| RoHS-Status | Compliant | — |
| Lead-Free | Yes | — |
| Family | — | Cyclone III |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 81,264 |
| Total RAM Bits | — | 2,810,880 bits |
| Embedded Multipliers | — | 244 (18x18) |
| User I/O | — | 429 |
| PLLs | — | 4 |
| Internal Frequency (max) | — | 472 MHz |
| Anzahl der Pins | — | 780 |
| Package Height | — | 2.60 mm |
| Lead Free / RoHS | — | Yes (lead-free) |
| Process Node | — | 60 nm TSMC low-k |
| Operating Temperature Grade | — | Commercial (C) |
| Speed Grade | — | 8 |