EP3CLS100F780C8N vs EP3C80F780C8N Comparaison
Comparaison détaillée côte à côte de EP3CLS100F780C8N par Intel et EP3C80F780C8N par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP3CLS100F780C8N | EP3C80F780C8N |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $105,80 | $240,20 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | — |
| Total Memory Bits | 4,451,328 | — |
| Embedded Memory Blocks | M9K + M144K | — |
| Logic Array Blocks (LAB) | 6,278 | — |
| Number of PLLs | 4 | — |
| Maximum User I/O | 429 | — |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Analog Supply (VCCA) | 2.5 V | — |
| Process Technology | 65 nm low-power CMOS | — |
| Maximum Embedded Multipliers (18x18) | 244 | — |
| Boîtier | 780-ball FBGA (FineLine BGA) | 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm ball pitch | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Type de montage | Surface Mount (BGA) | Surface Mount |
| Configuration Schemes | AS, PS, PP, JTAG | — |
| Statut RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Family | — | Cyclone III |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Logic Elements | — | 81,264 |
| Total RAM Bits | — | 2,810,880 bits |
| Embedded Multipliers | — | 244 (18x18) |
| User I/O | — | 429 |
| PLLs | — | 4 |
| Internal Frequency (max) | — | 472 MHz |
| Nombre de broches | — | 780 |
| Package Height | — | 2.60 mm |
| Lead Free / RoHS | — | Yes (lead-free) |
| Process Node | — | 60 nm TSMC low-k |
| Operating Temperature Grade | — | Commercial (C) |
| Speed Grade | — | 8 |