EP3CLS100F780C8N vs EP3CLS150F780I7N Vergleich
Detaillierter Direktvergleich von EP3CLS100F780C8N von Intel und EP3CLS150F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS100F780C8N | EP3CLS150F780I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $105,80 | $128,00 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | — |
| Total Memory Bits | 4,451,328 | — |
| Embedded Memory Blocks | M9K + M144K | — |
| Logic Array Blocks (LAB) | 6,278 | — |
| Number of PLLs | 4 | 4 |
| Maximum User I/O | 429 | 413 |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Analog Supply (VCCA) | 2.5 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Maximum Embedded Multipliers (18x18) | 244 | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-FBGA (FineLine BGA) |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm ball pitch | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Schemes | AS, PS, PP, JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Cyclone III LS |
| Logic Elements | — | 150,848 |
| Embedded Memory Bits | — | 6,137,856 |
| Pins / Balls | — | 780 |
| Supply Voltage (Core) | — | 1.2 V |
| Maximum Internal Frequency | — | 437 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Configuration Method | — | JTAG, Passive Serial (EPCS), Active Serial |
| Security Features | — | AES-128/256 bitstream encryption, JTAG security, tamper detection |
| MSL-Level | — | 3 |
| Device Type | — | FPGA - Field Programmable Gate Array |