EP3CLS100F780C8N vs EP3CLS150F780I7N Comparación
Comparación detallada lado a lado de EP3CLS100F780C8N por Intel y EP3CLS150F780I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS100F780C8N | EP3CLS150F780I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $105,80 | $128,00 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 100,448 | — |
| Total Memory Bits | 4,451,328 | — |
| Embedded Memory Blocks | M9K + M144K | — |
| Logic Array Blocks (LAB) | 6,278 | — |
| Number of PLLs | 4 | 4 |
| Maximum User I/O | 429 | 413 |
| Core Supply Voltage (VCCINT) | 1.2 V | — |
| Analog Supply (VCCA) | 2.5 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-power CMOS |
| Maximum Embedded Multipliers (18x18) | 244 | — |
| Encapsulado | 780-ball FBGA (FineLine BGA) | 780-FBGA (FineLine BGA) |
| Package Dimensions | 29 mm x 29 mm, 1.0 mm ball pitch | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Configuration Schemes | AS, PS, PP, JTAG | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Family | — | Cyclone III LS |
| Logic Elements | — | 150,848 |
| Embedded Memory Bits | — | 6,137,856 |
| Pins / Balls | — | 780 |
| Supply Voltage (Core) | — | 1.2 V |
| Maximum Internal Frequency | — | 437 MHz |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Configuration Method | — | JTAG, Passive Serial (EPCS), Active Serial |
| Security Features | — | AES-128/256 bitstream encryption, JTAG security, tamper detection |
| Nivel MSL | — | 3 |
| Device Type | — | FPGA - Field Programmable Gate Array |