EP3CLS100F780I7 vs EP3CLS100F780C8N Vergleich

Detaillierter Direktvergleich von EP3CLS100F780I7 von Intel und EP3CLS100F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS100F780I7 EP3CLS100F780C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $775,00 $105,80
Device Family Cyclone III LS Cyclone III LS
Device Type FPGA (Field Programmable Gate Array) —
Logic Elements 100,448 —
Embedded Memory Bits 4,451,328 bits (~4.4 Mbit) —
Number of Logic Array Blocks 47 (per distributor summary) —
Number of Transceivers 4 —
Maximum User I/O 413 429
Gehäuse 780-ball FBGA (F780) 780-ball FBGA (FineLine BGA)
Supply Voltage (Core) 1.2 V —
Operating Temperature Grade Industrial (-40C to +100C) —
Process Technology 60 nm low-power CMOS 65 nm low-power CMOS
Configuration Method SRAM-based, JTAG or external flash (EPCS/EPCQ) —
I/O Standards Supported LVDS, LVCMOS, LVTTL, SSTL, HSTL —
PLLs Up to 8 (family maximum) —
Security Features 256-bit AES bitstream encryption, JTAG disable —
RoHS-Status Compliant Compliant
Montageart Surface Mount (BGA) Surface Mount (BGA)
Logic Elements (LE) — 100,448
Total Memory Bits — 4,451,328
Embedded Memory Blocks — M9K + M144K
Logic Array Blocks (LAB) — 6,278
Number of PLLs — 4
Core Supply Voltage (VCCINT) — 1.2 V
Analog Supply (VCCA) — 2.5 V
Maximum Embedded Multipliers (18x18) — 244
Package Dimensions — 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) — 0C to +85C
Configuration Schemes — AS, PS, PP, JTAG
Lead-Free — Yes

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