EP3CLS150F484C7 vs EP3C40F484C7N Vergleich
Detaillierter Direktvergleich von EP3CLS150F484C7 von Intel und EP3C40F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS150F484C7 | EP3C40F484C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $720,00 | $264,00 |
| Family | Cyclone III LS | — |
| Logic Elements (LE) | 149,760 | — |
| Total Memory Bits | 6,138,560 | 1,161,216 |
| Embedded Multipliers (18x18) | 396 | — |
| User I/O Count | 210 | — |
| Configuration Logic Blocks (CLBs) | 150,848 | — |
| PLLs | 4 | 4 |
| Maximum User I/O Pins | 210 | — |
| Gehäuse | 484-FBGA (FineLine BGA), 23 x 23 mm, 1.0 mm pitch | 484-FBGA (F484), 1.0 mm pitch |
| Process Technology | 60 nm TSMC low-power CMOS | 65 nm low-power |
| Supply Voltage Core (VCCINT) | 1.2 V | — |
| Supply Voltage Auxiliary (VCCAUX) | 2.5 V | — |
| Operating Temperature (Commercial) | 0C to +85C | — |
| RoHS-Status | Compliant | Compliant (lead-free FBGA) |
| Montageart | Surface Mount | Surface Mount |
| AES Bitstream Encryption | AES-256 with 64-bit volatile key | — |
| Device Family | — | Cyclone III |
| Logic Elements | — | 39,600 |
| Embedded 18x18 Multipliers | — | 126 |
| Global Clock Networks | — | 20 |
| User I/Os | — | 331 |
| Configuration Memory | — | SRAM-based |
| Betriebstemperatur | — | 0C to +85C (commercial, C7 speed grade) |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, PCI |
| MSL-Level | — | 3 |