EP3CLS150F484C8N vs EP3CLS200F484C8N Vergleich
Detaillierter Direktvergleich von EP3CLS150F484C8N von Intel und EP3CLS200F484C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS150F484C8N | EP3CLS200F484C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $115,20 | $1.245,00 |
| Family | Cyclone III LS | Cyclone® III LS |
| Logic Elements (LE) | 150,848 | — |
| Total RAM Bits | 6,137,856 bits | — |
| Embedded Multipliers (18x18) | 210 | 396 |
| Logic Array Blocks (LABs) | 9,428 | [DATA_NEEDED: exact LAB count] |
| PLLs | 4 | — |
| User I/O Pins | 226 (maximum) | 210 |
| Process Technology | 65 nm low-power | 65 nm CMOS, low-leakage |
| Core Voltage (VCCINT) | 1.2 V | — |
| Gehäuse | 484-ball FBGA (FineLine BGA) | 484-ball FBGA (FineLine BGA), 23 x 23 mm |
| Speed Grade | 8 (commercial) | 8 (slowest) |
| Maximum Operating Frequency | 402 MHz | 402 MHz (fabric) |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Method | SRAM-based (external flash required) | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Cyclone III LS |
| Logic Elements | — | 198,464 |
| Embedded Memory | — | 8,211,456 bits (8.21 Mbit) |
| Number of PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Core Voltage | — | 1.2 V |
| Temperature Grade | — | Commercial (0C to +85C TJ) |
| Bitstream Encryption | — | AES-128 (256-bit key via separate license) |
| Configuration Mode | — | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG |