EP3CLS150F780I7N vs EP3CLS200F780I7N Vergleich
Detaillierter Direktvergleich von EP3CLS150F780I7N von Intel und EP3CLS200F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS150F780I7N | EP3CLS200F780I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $128,00 | $240,00 |
| Family | Cyclone III LS | — |
| Logic Elements | 150,848 | 198,464 |
| Embedded Memory Bits | 6,137,856 | — |
| Maximum User I/O | 413 | 413 |
| Gehäuse | 780-FBGA (FineLine BGA) | 780-ball FBGA (FBGA-780) |
| Pins / Balls | 780 | — |
| Supply Voltage (Core) | 1.2 V | — |
| Process Technology | 65 nm low-power CMOS | 65 nm CMOS (low-power) |
| Maximum Internal Frequency | 437 MHz | [DATA_NEEDED: maximum internal frequency MHz] |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Number of PLLs | 4 | — |
| Configuration Method | JTAG, Passive Serial (EPCS), Active Serial | — |
| Security Features | AES-128/256 bitstream encryption, JTAG security, tamper detection | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| MSL-Level | 3 | — |
| RoHS-Status | Compliant | Compliant (lead-free per FBGA-780 datasheet note) |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Device Family | — | Cyclone III LS |
| Series | — | EP3CLS200 |
| Logic Array Blocks (LABs) | — | 12,404 LAB |
| Embedded Memory (bits) | — | 8,211,456 |
| Embedded Multipliers | — | 425 (18x18) |
| PLLs | — | 4 |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Speed Grade | — | 7 |
| Betriebstemperatur | — | -40 °C to +100 °C (industrial) |
| Ball Pitch | — | 1.0 mm |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |