EP3CLS200F484C8N vs EP3CLS200F484C7N Vergleich
Detaillierter Direktvergleich von EP3CLS200F484C8N von Intel und EP3CLS200F484C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484C8N | EP3CLS200F484C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1.245,00 | $1.650,00 |
| Series | Cyclone III LS | Cyclone III LS |
| Family | Cyclone® III LS | — |
| Logic Elements | 198,464 | — |
| Embedded Memory | 8,211,456 bits (8.21 Mbit) | 8,211,456 bits |
| Logic Array Blocks (LABs) | [DATA_NEEDED: exact LAB count] | — |
| Embedded Multipliers (18x18) | 396 | — |
| User I/O Pins | 210 | — |
| Number of PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Process Technology | 65 nm CMOS, low-leakage | 65 nm low-power CMOS |
| Maximum Operating Frequency | 402 MHz (fabric) | — |
| Gehäuse | 484-ball FBGA (FineLine BGA), 23 x 23 mm | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Speed Grade | 8 (slowest) | — |
| Temperature Grade | Commercial (0C to +85C TJ) | — |
| Bitstream Encryption | AES-128 (256-bit key via separate license) | — |
| Configuration Mode | Active Serial (AS), Active Parallel (AP), Passive Serial (PS), JTAG | — |
| RoHS-Status | Compliant | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 12,404 |
| Embedded 18x18 Multipliers | — | 210 |
| User I/O | — | 226 |
| Betriebstemperatur | — | 0C to +85C (commercial) |
| Configuration Modes | — | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | — | 8 |
| Hot Socketing | — | Supported |
| PLLs | — | 4 |