EP3CLS200F484I7 vs EP3CLS200F484C7 Vergleich
Detaillierter Direktvergleich von EP3CLS200F484I7 von Intel und EP3CLS200F484C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F484I7 | EP3CLS200F484C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3.580,00 | $1.720,00 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 198464 | 198,464 |
| CLBs | 198464 | — |
| Total Memory Bits | 8211456 bits (~1.0 MB) | — |
| Embedded Memory Blocks | 432 M9K blocks | — |
| User I/O Pins | 210 | — |
| Maximum Operating Frequency | 450 MHz | — |
| Number of PLLs | 4 | — |
| Core Voltage | 1.2 V | — |
| Versorgungsspannung | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | CMOS, low-power |
| Betriebstemperatur | -40 °C to +85 °C (Industrial) | 0C to +85C (commercial, C7 speed grade) |
| Gehäuse | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Bitstream Encryption | AES (Cyclone III LS feature) | — |
| Family | — | Cyclone III LS |
| Logic Array Blocks (LABs) | — | 12,408 |
| Embedded Memory (RAM bits) | — | 8,211,456 |
| Maximum User I/Os | — | 226 |
| DSP Blocks | — | 396 (18x18 multipliers) |
| PLLs | — | 4 |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| I/O Supply Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| Configuration Method | — | JTAG, Passive Serial, Active Serial |
| RoHS-Status | — | Compliant |