EP3CLS200F484I7 vs EP3CLS200F484C7 Comparación
Comparación detallada lado a lado de EP3CLS200F484I7 por Intel y EP3CLS200F484C7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F484I7 | EP3CLS200F484C7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3.580,00 | $1.720,00 |
| Device Family | Cyclone III LS | — |
| Logic Elements (LE) | 198464 | 198,464 |
| CLBs | 198464 | — |
| Total Memory Bits | 8211456 bits (~1.0 MB) | — |
| Embedded Memory Blocks | 432 M9K blocks | — |
| User I/O Pins | 210 | — |
| Maximum Operating Frequency | 450 MHz | — |
| Number of PLLs | 4 | — |
| Core Voltage | 1.2 V | — |
| Tensión de alimentación | 1.2 V | — |
| Process Technology | 60 nm low-power CMOS | CMOS, low-power |
| Temperatura de funcionamiento | -40 °C to +85 °C (Industrial) | 0C to +85C (commercial, C7 speed grade) |
| Encapsulado | 484-ball FBGA (PBGA484, 23 x 23 mm, 1.0 mm pitch) | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Bitstream Encryption | AES (Cyclone III LS feature) | — |
| Family | — | Cyclone III LS |
| Logic Array Blocks (LABs) | — | 12,408 |
| Embedded Memory (RAM bits) | — | 8,211,456 |
| Maximum User I/Os | — | 226 |
| DSP Blocks | — | 396 (18x18 multipliers) |
| PLLs | — | 4 |
| Core Supply Voltage (VCCINT) | — | 1.2 V |
| I/O Supply Voltage (VCCIO) | — | 1.2 V to 3.3 V |
| Configuration Method | — | JTAG, Passive Serial, Active Serial |
| Estado RoHS | — | Compliant |