EP3CLS200F780C7 vs EP3CLS200F780C8ES Vergleich

Detaillierter Direktvergleich von EP3CLS200F780C7 von Altera und EP3CLS200F780C8ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS200F780C7 EP3CLS200F780C8ES
Marke Altera Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $102,40 $215,00
Series Cyclone III LS Cyclone III LS
Device Type FPGA - Field Programmable Gate Array —
Number of Logic Elements (LE) 198,464 —
Number of Logic Array Blocks (LAB) 8,212 —
Embedded Memory (Bits) 8,211,456 bit (7.83 Mbit) —
Maximum User I/Os 429 —
Gehäuse / Bauform 780-BGA, FBGA-780, 29 mm x 29 mm, 1 mm pitch —
Operating Supply Voltage (VCCINT) 1.15 V to 1.25 V —
Montagestil SMD/SMT —
Maximum Operating Temperature +70 C —
Minimum Operating Temperature 0 C —
Process Technology CMOS, low-power 65 nm CMOS (low-power)
Configuration Method SRAM, JTAG, Passive Serial, Passive Parallel —
Number of Transceivers 0 (no embedded high-speed transceivers) —
RoHS-Status Compliant Compliant (lead-free FBGA)
Family — Cyclone III LS
Logic Elements (LE) — 198,464
Logic Array Blocks (LABs) — 12,404
Embedded Memory (bits) — 8,211,456
Maximum User I/O — 413
Embedded 18x18 Multipliers — 396
PLLs — 4
Core Supply Voltage — 1.2 V
Betriebs-Sperrschichttemperatur — -40C to +100C (industrial)
Maximum Logic Clock Frequency — 402 MHz (typical)
Gehäuse — 780-ball FBGA (FineLine BGA)
Montageart — Surface Mount (BGA)
Configuration Encryption — AES bitstream encryption (LS feature)
Speed Grade — 8
On-Chip Termination (OCT) — Yes (calibrated)
Hot Socketing — Supported

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