EP3CLS200F780C8ES vs EP3CLS200F780I7N Vergleich
Detaillierter Direktvergleich von EP3CLS200F780C8ES von Intel und EP3CLS200F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F780C8ES | EP3CLS200F780I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $215,00 | $240,00 |
| Series | Cyclone III LS | EP3CLS200 |
| Family | Cyclone III LS | — |
| Logic Elements (LE) | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 | 12,404 LAB |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 |
| Maximum User I/O | 413 | 413 |
| Embedded 18x18 Multipliers | 396 | — |
| PLLs | 4 | 4 |
| Process Technology | 65 nm CMOS (low-power) | 65 nm CMOS (low-power) |
| Core Supply Voltage | 1.2 V | — |
| Betriebs-Sperrschichttemperatur | -40C to +100C (industrial) | — |
| Maximum Logic Clock Frequency | 402 MHz (typical) | — |
| Gehäuse | 780-ball FBGA (FineLine BGA) | 780-ball FBGA (FBGA-780) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant (lead-free FBGA) | Compliant (lead-free per FBGA-780 datasheet note) |
| Configuration Encryption | AES bitstream encryption (LS feature) | — |
| Speed Grade | 8 | 7 |
| On-Chip Termination (OCT) | Yes (calibrated) | — |
| Hot Socketing | Supported | — |
| Device Family | — | Cyclone III LS |
| Logic Elements | — | 198,464 |
| Embedded Multipliers | — | 425 (18x18) |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Betriebstemperatur | — | -40 °C to +100 °C (industrial) |
| Maximum Internal Frequency | — | [DATA_NEEDED: maximum internal frequency MHz] |
| Ball Pitch | — | 1.0 mm |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG |