EP3CLS200F780C8N vs EP3CLS100F780C8N Vergleich

Detaillierter Direktvergleich von EP3CLS200F780C8N von Intel und EP3CLS100F780C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3CLS200F780C8N EP3CLS100F780C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $943,88 $105,80
Family Cyclone III LS —
Logic Elements 198,464 —
Embedded Memory Bits 8,211,456 bits (approximately 1008 Kbytes) —
Maximum User I/O Pins 413 —
Number of PLLs 4 4
Number of Global Clock Networks 20 —
Process Technology 65 nm CMOS 65 nm low-power CMOS
Core Supply Voltage (VCCINT) 1.2 V (typical) 1.2 V
Speed Grade C8 (commercial, 8 ns) —
Betriebstemperaturbereich 0C to +85C (commercial) —
Gehäuse 780-ball FBGA (FineLine BGA) 780-ball FBGA (FineLine BGA)
Montageart Surface Mount Surface Mount (BGA)
MSL-Level 3 (per JEDEC J-STD-020) —
RoHS-Status Compliant (lead-free FBGA) Compliant
Bitstream Encryption AES-128 (Cyclone III LS feature) —
Configuration Modes JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) —
Multipliers (18x18) 396 (Cyclone III LS family characteristic) —
Device Family — Cyclone III LS
Logic Elements (LE) — 100,448
Total Memory Bits — 4,451,328
Embedded Memory Blocks — M9K + M144K
Logic Array Blocks (LAB) — 6,278
Maximum User I/O — 429
Analog Supply (VCCA) — 2.5 V
Maximum Embedded Multipliers (18x18) — 244
Package Dimensions — 29 mm x 29 mm, 1.0 mm ball pitch
Operating Temperature (Commercial) — 0C to +85C
Configuration Schemes — AS, PS, PP, JTAG
Lead-Free — Yes

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