EP3CLS200F780I7 vs EP3CLS200F780C8ES Vergleich
Detaillierter Direktvergleich von EP3CLS200F780I7 von Intel und EP3CLS200F780C8ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F780I7 | EP3CLS200F780C8ES |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $142,50 | $215,00 |
| Series | Cyclone III LS | Cyclone III LS |
| Device Family | Cyclone III LS | — |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,040 LAB | 12,404 |
| Total Memory Bits | 8,475 Kbits | — |
| Embedded 18x18 Multipliers | 396 | 396 |
| User I/O Pins | 429 | — |
| PLLs | 4 | 4 |
| Maximum Operating Frequency | 274 MHz | — |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| Gehäuse | 780-BGA (FBGA) | 780-ball FBGA (FineLine BGA) |
| Package Pins | 780 | — |
| Montageart | Surface Mount (SMD/SMT) | Surface Mount (BGA) |
| Betriebstemperatur | -40 C to +85 C (Industrial) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| RoHS-Status | Compliant | Compliant (lead-free FBGA) |
| Moisture Sensitivity Level | MSL 3 | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Embedded Memory (bits) | — | 8,211,456 |
| Maximum User I/O | — | 413 |
| Process Technology | — | 65 nm CMOS (low-power) |
| Betriebs-Sperrschichttemperatur | — | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | — | 402 MHz (typical) |
| Configuration Encryption | — | AES bitstream encryption (LS feature) |
| Speed Grade | — | 8 |
| On-Chip Termination (OCT) | — | Yes (calibrated) |
| Hot Socketing | — | Supported |