EP3CLS200F780I7 vs EP3CLS200F780C8ES Comparación
Comparación detallada lado a lado de EP3CLS200F780I7 por Intel y EP3CLS200F780C8ES por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F780I7 | EP3CLS200F780C8ES |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $142,50 | $215,00 |
| Series | Cyclone III LS | Cyclone III LS |
| Device Family | Cyclone III LS | — |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,040 LAB | 12,404 |
| Total Memory Bits | 8,475 Kbits | — |
| Embedded 18x18 Multipliers | 396 | 396 |
| User I/O Pins | 429 | — |
| PLLs | 4 | 4 |
| Maximum Operating Frequency | 274 MHz | — |
| Core Supply Voltage | 1.15 V to 1.25 V | 1.2 V |
| Encapsulado | 780-BGA (FBGA) | 780-ball FBGA (FineLine BGA) |
| Package Pins | 780 | — |
| Tipo de montaje | Surface Mount (SMD/SMT) | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40 C to +85 C (Industrial) | — |
| Configuration Modes | JTAG, AS, PS, FPP | — |
| Estado RoHS | Compliant | Compliant (lead-free FBGA) |
| Moisture Sensitivity Level | MSL 3 | — |
| Family | — | Cyclone III LS |
| Logic Elements (LE) | — | 198,464 |
| Embedded Memory (bits) | — | 8,211,456 |
| Maximum User I/O | — | 413 |
| Process Technology | — | 65 nm CMOS (low-power) |
| Temperatura de unión de funcionamiento | — | -40C to +100C (industrial) |
| Maximum Logic Clock Frequency | — | 402 MHz (typical) |
| Configuration Encryption | — | AES bitstream encryption (LS feature) |
| Speed Grade | — | 8 |
| On-Chip Termination (OCT) | — | Yes (calibrated) |
| Hot Socketing | — | Supported |