EP3CLS200F780I7N vs EP3CLS150F780I7N Vergleich
Detaillierter Direktvergleich von EP3CLS200F780I7N von Intel und EP3CLS150F780I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F780I7N | EP3CLS150F780I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $240,00 | $128,00 |
| Device Family | Cyclone III LS | — |
| Series | EP3CLS200 | — |
| Logic Elements | 198,464 | 150,848 |
| Logic Array Blocks (LABs) | 12,404 LAB | — |
| Embedded Memory (bits) | 8,211,456 | — |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | — |
| Maximum User I/O | 413 | 413 |
| Process Technology | 65 nm CMOS (low-power) | 65 nm low-power CMOS |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | — |
| Speed Grade | 7 | — |
| Betriebstemperatur | -40 °C to +100 °C (industrial) | — |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | 437 MHz |
| Gehäuse | 780-ball FBGA (FBGA-780) | 780-FBGA (FineLine BGA) |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant (lead-free per FBGA-780 datasheet note) | Compliant |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Family | — | Cyclone III LS |
| Embedded Memory Bits | — | 6,137,856 |
| Pins / Balls | — | 780 |
| Supply Voltage (Core) | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Number of PLLs | — | 4 |
| Configuration Method | — | JTAG, Passive Serial (EPCS), Active Serial |
| Security Features | — | AES-128/256 bitstream encryption, JTAG security, tamper detection |
| MSL-Level | — | 3 |
| Device Type | — | FPGA - Field Programmable Gate Array |