EP3CLS200F780I7N vs EP3CLS200F780C7N Vergleich
Detaillierter Direktvergleich von EP3CLS200F780I7N von Intel und EP3CLS200F780C7N von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3CLS200F780I7N | EP3CLS200F780C7N |
|---|---|---|
| Marke | Intel | Altera |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $240,00 | $199,50 |
| Device Family | Cyclone III LS | Cyclone III LS |
| Series | EP3CLS200 | EP3CLS200 |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 LAB | — |
| Embedded Memory (bits) | 8,211,456 | — |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | — |
| Maximum User I/O | 413 | 429 |
| Process Technology | 65 nm CMOS (low-power) | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.2 V |
| Speed Grade | 7 | C7 (commercial, -7 speed bin) |
| Betriebstemperatur | -40 °C to +100 °C (industrial) | 0C to +85C (commercial) |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| Gehäuse | 780-ball FBGA (FBGA-780) | — |
| Ball Pitch | 1.0 mm | — |
| Montageart | Surface Mount | — |
| RoHS-Status | Compliant (lead-free per FBGA-780 datasheet note) | Compliant |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 9,923 |
| Embedded Memory | — | 7,829 Kbit |
| Embedded Multipliers (18x18) | — | 413 |
| Phase-Locked Loops (PLL) | — | 4 |
| Global Clock Networks | — | 20 |
| Supply Voltage (Datasheet Reference) | — | 1.2 V |
| Package Type | — | FBGA-780 |
| Package Code | — | BGA |