EP3CLS200F780I7N vs EP3CLS200F780C7N Comparación
Comparación detallada lado a lado de EP3CLS200F780I7N por Intel y EP3CLS200F780C7N por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3CLS200F780I7N | EP3CLS200F780C7N |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $240,00 | $199,50 |
| Device Family | Cyclone III LS | Cyclone III LS |
| Series | EP3CLS200 | EP3CLS200 |
| Logic Elements | 198,464 | — |
| Logic Array Blocks (LABs) | 12,404 LAB | — |
| Embedded Memory (bits) | 8,211,456 | — |
| Embedded Multipliers | 425 (18x18) | — |
| PLLs | 4 | — |
| Maximum User I/O | 413 | 429 |
| Process Technology | 65 nm CMOS (low-power) | — |
| Core Voltage (VCCINT) | 1.15 V to 1.25 V | 1.2 V |
| Speed Grade | 7 | C7 (commercial, -7 speed bin) |
| Temperatura de funcionamiento | -40 °C to +100 °C (industrial) | 0C to +85C (commercial) |
| Maximum Internal Frequency | [DATA_NEEDED: maximum internal frequency MHz] | — |
| Encapsulado | 780-ball FBGA (FBGA-780) | — |
| Ball Pitch | 1.0 mm | — |
| Tipo de montaje | Surface Mount | — |
| Estado RoHS | Compliant (lead-free per FBGA-780 datasheet note) | Compliant |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| Logic Elements (LE) | — | 198,464 |
| Logic Array Blocks (LAB) | — | 9,923 |
| Embedded Memory | — | 7,829 Kbit |
| Embedded Multipliers (18x18) | — | 413 |
| Phase-Locked Loops (PLL) | — | 4 |
| Global Clock Networks | — | 20 |
| Supply Voltage (Datasheet Reference) | — | 1.2 V |
| Package Type | — | FBGA-780 |
| Package Code | — | BGA |